| Setšoantšo | Nomoro ea Karolo | Tlhaloso | Stock | Reka |
|---|---|---|---|---|
 |
RASWLF.031 4OZChip Quik, Inc. |
LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
E teng thepeng e teng ka lebenkeleng: 5586 |
|
 |
SMDIN52SN48Chip Quik, Inc. |
INDIUM SOLDER WIRE (IN52/SN48) 0 |
E teng thepeng e teng ka lebenkeleng: 5513 |
|
 |
SMD2190Chip Quik, Inc. |
SOLDER SPHERES 63/37 .020 DIAM |
E teng thepeng e teng ka lebenkeleng: 1648 |
|
 |
SMDLTLFP60T4Chip Quik, Inc. |
SN42/BI57.6/AG0.4 2-PART MIX 60G |
E teng thepeng e teng ka lebenkeleng: 2930 |
|
 |
TS391SNL50Chip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
E teng thepeng e teng ka lebenkeleng: 6128 |
|
 |
NC191LT50T5Chip Quik, Inc. |
SMOOTH FLOW LOW TEMP SOLDER PAST |
E teng thepeng e teng ka lebenkeleng: 3935 |
|
 |
SMD2205Chip Quik, Inc. |
SOLDER SPHERES 63/37 .025 DIAM |
E teng thepeng e teng ka lebenkeleng: 1708 |
|
 |
TS391LT250Chip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
E teng thepeng e teng ka lebenkeleng: 1648 |
|
 |
SMDLTLFP15T4Chip Quik, Inc. |
TWO PART MIX SOLDER PASTE |
E teng thepeng e teng ka lebenkeleng: 5513 |
|
 |
SMDLTLFP500T3Chip Quik, Inc. |
SOLDER PASTE SN42/BI58 500G |
E teng thepeng e teng ka lebenkeleng: 859 |
|
 |
SMD2SWLT.040 50GChip Quik, Inc. |
SN42/BI57.6/AG0.4 2.2% FLUX CORE |
E teng thepeng e teng ka lebenkeleng: 1911 |
|
 |
SMDAL200Chip Quik, Inc. |
ALUMINUM SOLDER PASTE WATER-SOLU |
E teng thepeng e teng ka lebenkeleng: 2323 |
|
 |
SMDLTLFP250T4Chip Quik, Inc. |
SOLDER PASTE LOW TEMP T4 250G |
E teng thepeng e teng ka lebenkeleng: 1667 |
|
 |
SMD2170-25000Chip Quik, Inc. |
SOLDER SPHERES SN63/PB37 .014" ( |
E teng thepeng e teng ka lebenkeleng: 5513 |
|
 |
SMD2SWLF.015 4OZChip Quik, Inc. |
LF SOLDER WIRE 99.3/0.7 TIN/COPP |
E teng thepeng e teng ka lebenkeleng: 4766 |
|
 |
NC191AX500CChip Quik, Inc. |
SMOOTH FLOW LEADED SOLDER PASTE |
E teng thepeng e teng ka lebenkeleng: 1557 |
|
 |
RASW.020 .4OZChip Quik, Inc. |
SOLDER WIRE POCKET PACK 63/37 TI |
E teng thepeng e teng ka lebenkeleng: 22375 |
|
 |
TS391LT10Chip Quik, Inc. |
THERMALLY STABLE SOLDER PASTE NO |
E teng thepeng e teng ka lebenkeleng: 3799 |
|
 |
BARSN99.3CU0.7Chip Quik, Inc. |
SOLDER BAR SN99.3/CU0.7 1LB SUPE |
E teng thepeng e teng ka lebenkeleng: 3183 |
|
 |
SMD3SW.031 8OZChip Quik, Inc. |
SOLDER WIRE 62/36/2 TIN/LEAD/SIL |
E teng thepeng e teng ka lebenkeleng: 4596 |